AUTOMATIC LASER MICRO-SOLDERING EQUIPMENT

全自动激光微焊接设备主要适用于摄像头模组、VCM、硬盘磁头、光通信元器件、热敏和光敏元件等传统方式难以焊接的产品。该设备可以实现产品的全自动激光焊接工艺，实现料盒上料，TRAY盘自动出料，CCD自动定位、自动点锡、激光同轴CCD自动焊接， NG料自动检测及分拣、自动出料等，满足客户产品的全自动焊接生产需求。

AUTOMATIC LASER MICRO-SOLDERING EQUIPMENT could be applied to camera module, VCM, hard disk heads, optical communication components, thermo-sensitive and photosensitive elements, and other similar products, which is difficult to solder using traditional way. This type of equipment could realize automatic laser soldering process, it can achieve automatic loading material, Tray plate automatic discharging, CCD automatic positioning, automatic pointing paste, CCD automatic coaxial laser soldering, NG feeding automatic detection and sorting, automatic