SW 系列晶圆对准/键合/解键合设备可应用于多个领域，包括 MEMS、功率器件、图像传感器、先进封装(3D-TSV、WLP) 和化合物半导体 (LED、RF 器件) 等。其中，SWA 系列能够满足各类基底的键合对准需求，SWB 系列可应用于有机胶键合、玻璃浆料键合、共晶键合，阳极键合等工艺，而SWDB 系列满足解键合工艺需求。

The SW series aligner/ bonder / debonder are designedfor various types of applications in MEMS, power devices.CMOS image sensor, advanced packaging (3D-TSV, WLPetc.) and compound semiconductor (LED, RF, etc.). TheSWA is for bonding and alignment of different wafers.The SWB covers multiple bonding methods, includingadhesive, glass-frit, eutectic and anodic. The SWDB is tomeet debonding process requirements.