| 产品特点Features | 产品应用Applications | ||
| ◆ 线偏振/Linear Polarization | ◆ 薄玻璃切割/ Thin Glass Cutting | ||
◆ 高脉冲对比度 /High Pulse Extinguish Ratio ◆ 太阳能电池划割/Solar Cell Separation | |||
| ◆ 优良的光束质量/Excellent Beam Quality ◆ 微机械加工/Fine Drilling | |||
| ◆ 高抗反射能力/High Anti-reflection | ◆ 硅晶圆加工/Wafer Scribing | ||
| ◆ 免维护/Maintenance-free | ◆ OLED面板单元加工/ panel micromachining | ||
| ◆ 脉冲时间抖动小/Low Timing Jitter | ◆ 精密打标/Marking | ||
1. 无热效应所致的损害：高质量微加工效果， 尤其是对热效应敏感材料的加工；
2. 无与伦比的加工精度：可达到100 nm 加工精度;
3. 加工和激光波长无关：任何材料都可以用同样的一台飞秒激光来加工。
1.No thermal damage: High machining quality, heat sensitive material machining
2. Unmatched accuracy: Down to 100nm (very well defined ablation threshold)
3. No Wavelength dependence: Any material can be machinied with the same laser
| 技术参数/Specifications | |||
| 参数/Parameters | 单位/Unit | Y15CPA | |
| 工作模式(Working Mode) | Pulse | ||
| 中心波长(Center Wavelength) | nm | 1040±10 | |
| 最大光功率(Average Power) | W | 1-10 | |
| 典型光功率(Typical Power) | W |
5w@500KHz | |
| 脉冲宽度(Pulse Width) | fs | < 600 | |
| 重复频率(Pulse Repetition Rate) | MHz | 0.1 - 5 | |
| 偏振(Polarization) | linear | ||
| 消光比(Extinction Ratio) | dB | ＞20 | |
| 脉冲能量(Pulse Energy) | μJ | 10 | |
| 光束质量 M^2(Beam Quality M^2) | ≤ 1.3 | ||
| 输出光斑直径(Collimated Beam Diameter) | mm | 0.5 - 8 | |
| 光功率可调范围(Output Power Tunability) | % | 10 - 100 | |
| 功率稳定度(Power Stability) | % | < 2 | |
| 传递光纤长度(Delivering Fiber Length) | m | 0.5 | |
| 工作环境/Working Conditions | |||
| 功率消耗(Power Consumption) | W | <400 | |
| 工作电压(Working Voltage) | VDC | 24 | |
| 工作温度(Operating Temperature) | °C | 20 to 30 | |
| 存储温度(Storage Temperature) | °C | 0 to 50 | |
| 体积(Dimensions) (L x W x H) | mm | 1050 x 402 x 224 | |
| 重量(Weight) | kg | 55 | |
* 本产品可以根据客户要求定制 | |||