Precision pattern generators 掩膜板激光直写系统 |
Pattern generators are considered to be the most complex devices in mask making. High requirements for such equipment are met only with the help of high-end technology.Scanning laser generators represent a new generation of multichannel laser pattern generators for making masks, reticles and direct writing on wafers without any die size limitation. The pattern generator enables to make high precision features on the mask, to write phase shift masks and optical proximity masks. Pattern generation time depends on die size only and is irrespective of the layer pattern complexity. Production from 20127th generation: 90 nm technology nodeEМ-5389 Rmin=200 nm Production from 20086th generation: 180 nm technology nodeEМ-5289 Rmin=350 nm Production from 20055th generation: 350 nm technology nodeEМ-5189 Rmin=600 nmProduction from 19994th generation: 500 nm technology nodeEМ-5089B Rmin=800 nmProduction from 19943rd generation: 1.0 µm technology nodeEМ-5089A Rmin=1.0 µmProduction from 19882nd generation: 1.5 µm technology nodeEМ-5089 Rmin=1.5 µmProduction from 19881st generation: 2.0 µm technology nodeEМ-589B Rmin=2.0 µm
EМ-5389 Multichannel laser pattern generator |
Special application pattern generator 特殊用途激光直写系统 |
A separate model line of laser pattern generators was developed by KBTEM-OMO for special applications in the semiconductor production. |
Automatic mask inspection 全自动掩膜板检测系统 |
Pattern inspection is of decisive significance in the semiconductor industry. Single microscopes as well as powerful optical systems are used for submicron structures. KBTEM-OMO developed a model line of systems for the automatic inspection of reticle patterns. Creation of the systems for the 45-60 nm technological node was a response to meet newest requirements of modern time.
Production from 20097th generation: 65-45 nm technology nodeEМ-6729 Rmin=65 nmProduction from 20086th generation: 110 nm technology nodeEМ-6329B Rmin=150 nmProduction from 20065th generation: 180 nm technology nodeEМ-6329R Rmin=250 nmProduction from 20014th generation: 350 nm technology nodeEМ-6029BRmin=500 nmProduction from 19953rd generation: 800 nm technology nodeEМ-6029АМRmin=800 nmProduction from 19912nd generation: 1.0 µm technology nodeEМ-6029АRmin=1.0 µmProduction from 19871st generation: 1.5 µm technology nodeEМ-6029Rmin=1.5 µm
EМ-6729 Automatic mask inspection system ЭМ-6329 Automatic mask inspection system |
Laser-based mask defect repair systems 掩膜板缺陷激光修复系统 |
The laser-based mask defect repair systems are intended to repair photomasks with transparent and opaque defects.
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Systems for inspection of work masks 掩膜板在线检测系统 |
This class of equipment is intended for inspection of multiple work masks on the basis of master masks for series and low batch semiconductor production: |
Photorepeaters 光刻机 |
This class of equipment is intended for fabrication and inspection of step-and-repeat work masks on the basis of reticles for large-scale and low volume semiconductor production:A contact printing system for patterning of work masks /under development/.EМ-5062M Photorepeater |