Precision pattern generators  掩膜板激光直写系统
 Pattern generators are considered to be the most complex devices in mask making. High requirements for such equipment are met only with the help of high-end technology.Scanning laser generators represent a new generation of multichannel laser pattern generators for making masks, reticles and direct writing on wafers without any die size limitation. The pattern generator enables to make high precision features on the mask, to write phase shift masks and optical proximity masks. Pattern generation time depends on die size only and is irrespective of the layer pattern complexity.

 


 

Production from 20127th generation: 90 nm technology nodeEМ-5389 Rmin=200 nm Production from 20086th generation: 180 nm technology nodeEМ-5289 Rmin=350 nm Production from 20055th generation: 350 nm technology nodeEМ-5189 Rmin=600 nmProduction from 19994th generation: 500 nm technology nodeEМ-5089B Rmin=800 nmProduction from 19943rd generation: 1.0 µm technology nodeEМ-5089A Rmin=1.0 µmProduction from 19882nd generation: 1.5 µm technology nodeEМ-5089 Rmin=1.5 µmProduction from 19881st generation: 2.0 µm technology nodeEМ-589B Rmin=2.0 µm

 

EМ-5389 Multichannel laser pattern generator

EМ-5289 Multichannel laser pattern generator

EМ-5189-01 Multichannel laser pattern generator


Special application pattern generator   特殊用途激光直写系统

 

A separate model line of laser pattern generators was developed by KBTEM-OMO for special applications in the semiconductor production.
Pattern generation is based on the microphotosetting principle.

EМ-5109 Laser pattern generator

EM-5009М Pattern generator

 

Automatic mask inspection 全自动掩膜板检测系统 

 

Pattern inspection is of decisive significance in the semiconductor industry. Single microscopes as well as powerful optical systems are used for submicron structures. KBTEM-OMO developed a model line of systems for the automatic inspection of reticle patterns. Creation of the systems for the 45-60 nm technological node was a response to meet newest requirements of modern time.

 

Production from 20097th generation: 65-45 nm technology nodeEМ-6729  Rmin=65 nmProduction from 20086th generation: 110 nm technology nodeEМ-6329B  Rmin=150 nmProduction from 20065th generation: 180 nm technology nodeEМ-6329R Rmin=250 nmProduction from 20014th generation: 350 nm technology nodeEМ-6029BRmin=500 nmProduction from 19953rd generation: 800 nm technology nodeEМ-6029АМRmin=800 nmProduction from 19912nd generation: 1.0 µm technology nodeEМ-6029АRmin=1.0 µmProduction from 19871st generation: 1.5 µm technology nodeEМ-6029Rmin=1.5 µm

 

EМ-6729 Automatic mask inspection system

ЭМ-6329 Automatic mask inspection system

EМ-6029B Automatic mask inspection system

EМ-6015M Automated photomask inspection system



Laser-based mask defect repair systems  掩膜板缺陷激光修复系统

The laser-based mask defect repair systems are intended to repair photomasks with transparent and opaque defects.
A contour-projection method is used to form an optical image for the repair of opaque defects. Transparent defects are repaired through the laser-stimulated vapor deposition of metal-organic compounds.
Defects are detected automatically on the bases of the defect file formed at the inspection stage.
The model line of the laser-based mask defect repair systems, developed and manufactured by the company, is presented in the table as follows:

Production from 20096th generation: 90 nm technology nodeEМ-5131 Rmin=200 nm Production from 20075th generation: 180 nm technology nodeEМ-5201 Rmin=500 nm Production from 20014th generation: 350 nm technology nodeEМ-5001В Rmin=500 nmProduction from 19953th generation: 500 nm technology nodeEМ-5001AM Rmin=1.1 µmProduction from 19902rd generation: 1.0 µm technology nodeEМ-5001A Rmin=1.5 µmProduction from 19901nd generation: 1.5 µm technology nodeEМ-551B Rmin=2.0 µm

 

EМ-5131 Laser-based mask defect repair system

EМ-5001В Laser-based mask defect repair system



Systems for inspection of work masks   掩膜板在线检测系统

This class of equipment is intended for inspection of multiple work masks on the basis of master masks for series and low batch semiconductor production:
- Automated microsize inspection tool
- Mask pattern coordinates measurement system

EМ-6239-01 Automated micro size inspection system

EМ-6209 Mask pattern coordinates measurement system


Photorepeaters  光刻机 

 

 This class of equipment is intended for fabrication and inspection of step-and-repeat work masks on the basis of reticles for large-scale and low volume semiconductor production:A contact printing system for patterning of work masks /under development/.EМ-5062M Photorepeater