Nikon Auto wafer warpage and die shift measuring system

                                                                                 Nikon Wafer Bump Measure VMR-OCDM2.jpg


Excellent auto loading system Integrated   Nikon high accurancy measurement system ,Achievement ultra wafer loading and   measuring


Nikon Wafer Bump Measure VMR-OCDM.jpg

Overview
  
  ‧Available for 12" and 8" wafer warpage and die shift   measurement by fully auto 
  ‧Available for resin wafer (eWLB) glass wafer and ultra wapage wafer   loading and measuring 
  ‧Maxima wafer wapage tolerance 8" +/- 2000um;12" +/- 4mm 
  ‧Enclosure with FFU,SECS/GEM,Wafer OCR are available for option 
  ‧3 type magnification selectable

‧Available for   customize auto loading system