Xenics’的XSW-640 OEM模块 非常紧凑且通用, 可轻易并快速地集成到您的SWIR 成像配置中。
普通的OEM应用包括: 人物红外成像、–便携式 和无人(航空和陆基) 设备有效载荷、夜视、边境 安全、搜索&救援(SAR)以及 其他应用。
XSW-640 OEM模块可探测 0.9(可选0.4)到1.7 μm之间 的短波红外辐射, 并具备大动态范围和广泛的工作 温度范围。
热电(TE)稳定功能 可降低暗电流和噪音水平 。 结合内置的图像处理功能, 您可获得最佳对比度 和高图像质量。
优点和特点 :
连接便利性
高分辨率
640x480图像分辨率
欧洲制造
较小的20 μm像素尺寸
设计用于使用 :
边境安全
驾驶员辅助
光电有效载荷
增强视觉系统(EVS)
激光探测
夜间视觉(被动&主动)
搜索&救援
SWIR瞄准器
无人机/地面无人车辆(UAV / UGV)
兼容各种采集卡 Several compatible frame grabbers for CameraLink interface are available (Euresys Grablink Full, NI 1433 and Imperx Framelink Express VCE-CLEX01). |
兼容GigE Vision标准 The Gigabit Ethernet interface is compatible to the GigE Vision standard |
SWaP(小型化、轻量化和低功耗) Small volume, low weight and low power consumption for demanding applications |
触发 External trigger for signal synchronization |
开窗模式(ROI模式) Imaging in a reduced window of interest for increased frame rates |
视频输出 Analog video output available |
TrueNUC图像修正 Non uniformity correction for a wide range of integration times |
VisNIR选项 Visible enhanced InGaAs available (500 - 1700 nm) |
高动态范围 High dynamic range mode available |
昼夜(24h)均可使用 The camera can operate under daylight or nighttime conditions |
| 芯片参数 | XSW-320 Gated |
| Array type | InGaAs Focal Plan Array (FPA) ROIC with CTIA topology |
| Resolution | 320 x 256 |
| Pixel pitch | 20 μm |
| Spectral band | 0.9 μm to 1.7 μm |
| Pixel operability | > 99 % |
| Array cooling | TE1-stabilized |
| ROIC noise | 60 e- |
| Dark current | 0.19 x 10? e-/s/pixel or 30 fA @ 200 mV bias at 288 K |
| Full well capacity | 125 k e- |
| Module Specifications | XSW-640- Samtec | XSW-640- Analog | XSW-640- CL | XSW-640- GigE | |
| Lens | |||||
| Focal length | Broad selection of lenses available | ||||
| Optical interface | Fixation holes for multiple lens mounts | ||||
| Imaging performance | |||||
| Maximum frame rate (full frame) | 100 Hz | 25 Hz (PAL), 30 Hz or 9 Hz (NTSC) | 100 Hz | ||
| Min region size | Minimum size 32 x 4 | ||||
| Integration time range | 1 μs - 40 ms | ||||
| Noise level: High gain | 120 e- | ||||
| Noise level: Low gain | 400 e- | ||||
| Gain level: High gain | 1.28 e-/ADU | ||||
| Gain level: Low gain | 16.2 e-/ADU | ||||
| On-board image processing | Image correction (TrueNUC for high and low gain), Auto-Gain and offset, Auto-Exposure, Histogram-Equalization, Trigger Possibilities | Up to 4 NUCs, Auto-Gain, Trigger Possibilities | |||
| Analog-to-Digital (ADC) | 14 bits | ||||
| Interfaces | |||||
| Digital output format | BT.601-6/BT.656-5 | - | CameraLink or Xeneth API/SDK | GigE Vision or Xeneth API/SDK | |
| Analog output | - | PAL or NTSC | - | ||
| Module control | Serial LVCMOS 3 V (XSP) | RS232 (XSP) | CameraLink | GigE Vision | |
| Trigger | Trigger in or out (configurable) | ||||
| Power requirements | |||||
| Power consumption | +/- 2.6 W | 3 W | 2.8 W | 4 W | |
| Power supply | DC 12 V | ||||
| Physical characteristics | |||||
| Shock | 40 g, 11 ms according to MIL-STD810G/MIL-STD883J | ||||
| Vibration | 5 g (20 Hz to 2000 Hz) according to MIL-STD810G/MIL-STD883J | ||||
| Operating case temperature | -40ºC to 70ºC | ||||
| Storage temperature range | -40ºC to 85ºC | ||||
| Dimensions (width x height x length) - excluding lens (approximately) | 45 x 45 x 51 mm | 45 x 45 x 55 mm | 45 x 45 x 65 | ||
| Weight module | 120 g | 145 g | 129 g | 165 g | |