IPG Microsystems’ IX-6100 solid state laser machining system delivers high-speed wafer singulation integrated with a state-of-the-art wafer loading system. Designed to handle bare wafer and wafer frame open cassettes, the optional Dual Load Ports permit uninterrupted processing.

With low operation costs, combined with ultra narrow kerf widths, the IX-6100 sets a new benchmark in process speed, die yield and ultrafast return on investment. Available with wavelengths from 266-1064 nm, the IX-6100 is ready for processing a variety of materials—from Si to Sapphire— and when equipped with the patent-pending Toxic Wafer Debris nozzle, materials such as GaAs and InP are handled with ease.