IPG Microsystems’ IX-3000 is a Class 1 UV Excimer laser based step and scan ablation system for micro-machining, drilling and laser processing of a wide range of materials. The IX-3000 is a high-accuracy mask imaging system for large FOV processing applications and can readily integrate with high-volume part handling systems. Optical resolution, repeatability and accuracies are sub-micron with 0.2 to 0.3 micron repeatability. The IX-3000 is built on a granite-based structure with vibration and thermal damping for optimum stability. The entire system is optimized for high-speed operation. The IX-3000 offers a lower cost of ownership and operation than competitive laser processing systems. Each system is customized including mask area, mask dynamics and step-and-repeat stages. The IX-3000 can also be customized for applications with cassette-to-cassette wafer handling, robotics loading or tape and reel systems.

Main Features:

• Coordinated Opposing Motion (COMO): Large Field of View (FOV) with 
  High On-target Fluence

• High-precision Air-bearing Mask and Part Handling Stages offer Sub-micron Accuracy and Highest Throughput

• Synchronized Mask and and Part Handling Stages Provide Fast Large Area Patterning

• Reel-to-reel or Robotic Part Loading

• Increased Beam Utilization Factor with COMO Processing

Applications:

• Large Area Patterning

• Microvia Drilling

• Microelectronics Micromachining

• Manufacture of Inkjet Nozzle Arrays

• Flat Panel Displays

• Wafer Scale Processing

• Sensors

• Microfluidics