IPG Microsystems’ IX-210 solid-state laser machining system delivers high-speed wafer singulation with low cost, 20-30 times less than dicing saws or diamond scribes. With its extremely high throughput and process automation, the system pays for itself in weeks rather than years. The revolutionary IX-210 employs proprietary technology including lasers, optics, motion control and process automation, providing unparalleled performance; with multiple laser choices the system can be configured to process a multitude of materials.

Main Features: High Speed Wafer Singulation 300 mm/sec Scribe Rate for GaAs Narrow Cuts - Down to 2.5 microns Low Cost High Quality, Reliable Process   Advanced Applications: Scribing and Dicing of LED and Semiconductor Wafers Si, SiC, GaAs, Al2O3 Controlled Taper Hole Drilling for Probe Cards Metal Dicing Cu, Mo, Alloys