| Name | Imax (A) | Qmax (W) | Umax (V) | dTmax (K) | R (Ohm) | H (mm) | D (mm) | d1 |
|---|---|---|---|---|---|---|---|---|
TB-295-1.0-0.8CHR | 5.8 | 130 | 36.5 | 69 | 4.6 | 3.2 | 61 | 1 |
STANDARD TERMS OF DELIVERY:
— substrate material — alumina (ВК-96)
— height tolerance ± 0,05 mm (L1)
— parallelism 0,03 mm (L1)
— wire length 120 mm
— pin orientation (for rectangular coolers) — to the longer side
— processing temperature up to 80°С, maximal assembly temperature 120°С (assembly solder Tm = 139°С)
ADDITIONAL OPTIONS
Description | Notation (*) | Note |
| processing temperature up to 120 °C, max assembly temperature = 130 °C | HT(120) | assembly solder with Tm = 139 °C |
| processing temperature up to 150 °C, max assembly temperature = 170 °C | HT(150) | assembly solder Pb-Sn with Tm = 183 °C |
| processing temperature up to 200 °C, max assembly temperature = 220 °C | HT(200) | assembly solder with Tm = 232 °C |
| special version for operation under conditions of temperature cycling | С | > 105 cycles +40C/+90 °C |
| height tolerance = ± 0.025 mm and parallelism 0.02 mm | L2 | |
| height tolerance = ± 0.015 mm and parallelism 0.01 mm | L3 | |
| metallization of cold (mc) and (or) hot side of cooler with solder tinning (melting temperature = 95 °C, 117 °C, 139 °C, 183 °C) | mc95, mh95, mm117 etc. | |
| gold plating | mcAu, mhAu, mmAu | metallization Cu-Ni-Au (0.2-1 micron) |
| substrate material – aluminium nitride (AlN) | N | heat conductivity > 180 W/mK |
| sealant: epoxy, silicon, urethane, conformal coating | E, S, U, Сс | |
| non-standard pin orientation | ||
| type and length of wires by customer’s requirement | ||
| сonnection to arraies | ||
| сonnectors crimping | ||
| soldering on cold or hot heatsink, packaging or cold block |